X6 Pro

Qualcomm® QCM4490 Octa-Core, 2 x Gold A78@2,4 GHz, 6 x Silver A55@2,0 GHz

6” IPS capacitive multi-touch (10 points)
1080 x 1920 pixels
Sunlight readable
Glove/rain mode
Corning® Gorilla® Glass 3

Front: F1, F2, F3, Power
Side: FN, Volume up/down

3.8V 8000 mAh (30.4 Wh), field replaceable

Type-C, Qualcomm quick charge 3.1, OTG
GNSS antenna connector
Back connector for expandability
1x micro SDXC (supports SDXC up to 1TB)
2x Nano-SIM (DSDS)

Cellular (WWAN)
GSM: 850 / 900/ 1800 / 1900
WCDMA: B1/B2/B5/B8
LTE-TDD: B38/39/40/41
LTE-FDD: B1/2/3/4/5/7/8/12/13/14/17/20/25/26/28/48/66/71
5G: FR1 N1/2/3/5/20/28/41/48/66/71/77/78/79

Wireless LAN
IEEE 802.11 a/b/g/n/ac/ax
(2.4 & 5 GHz, WiFi 6E)

PAN
BT V5.2 BLE

NFC
NFC 13.56 MHz, work distance ≥ 3cm support
ISO/14443 A/B, ISO/15693, NFC- IP1, NFC-IP2, M1 Card (S50, S70), CPU Card, NFC Label

Audio
Headphone support via Type-C
Front-facing speaker, >95dB at 1 kHz, 10 cm
2 microphones for noise suppression

A-GPS / GPS L1+L5 / GLONASS / Galileo / Beidou
Qualcomm

Rear: 32 megapixel, double white LED flash
Front: 8 megapixel

Gyroscope, Compass, Accelerometer, Pressure, Proximity, Ambient light

Optional 2D imager

Operating
-20°C to 60°C
MIL-STD-810G, Method 501.5/502.5 Procedure II

Storage
-40°C to 70°C
MIL-STD-810G, Method 501.5/502.5 Procedure I

Drop/shock
6 drops from 1.5m, concrete surface
IEC 68-2-32:1990

Vibration
MIL-STD-810H:2019 Method 514.8/Procedure I

Mechanical shock
MIL-STD-810H:2019 Method 516.8/Procedure I

Sand and Dust
IP68, IEC 60529

Water
IP68, IEC 60529

Humidity
0% ～ 95% (non-condensing)
MIL-STD-810G, Method 507.5 Procedure II

Altitude
4572 m (15 000 ft.) 
MIL-STD-810G, Method 500.5 Procedures I & II

EMC/EMI
MIL-STD-461F: CE101, CE102, CS101, CS114, CS115, CS116, RE101, RE102, RS101, RS103